1. Suitable for 4-inch-dia. substrates.
2. Manual contact Mask Aligners.
3. Can handle silicon wafer, glass, chemical compound, film, and various other materials as well as irregular-sized substrates.
4. We have verification data on various resists.
Product Specifications
Maximum substrate size |
4 in. dia. |
Maximum substrate thickness |
2mm |
Maximum mask size |
5 × 5 in. |
UV lamp house |
Multi-mirror type |
Illuminance |
> 14 mW/cm2 (at 405 nm) |
Illuminance uniformity |
< ±4.0% |
Exposure source |
UV lamp, 500 W |
Exposure wavelength |
Broadband (g/h/i-line) |
Exposure timer |
Switched between modes:
0 to 999.9 sec (timer setting mode)
1 to 9999 counts (cumulative light quantity counter mode) |
UV lamp degradation correction function |
Included as standard |
Alignment scope |
Microscope with two fields of view; objectives spaced at intervals of 18 to 60 mm |
Alignment accuracy |
1.2 μm (when the 20× objective is used) |
Alignment gap measurement function |
Included as standard |
Contact method |
Soft contact and hard contact |
Movement range of manipulator |
X/Y: ±5 mm, fine movement in 1/8-mm steps, one full rotation
θ: 70°, fine movement in ±7° steps
Z: 4 mm (1 mm for pneumatic driving and 3 mm for coarse movement), fine movement in 0.16-mm steps |
Movement range of crosswise motion stage |
X/Y: ±20 mm |
Power supply |
100 to 110 V AC, 20 A |
Utility |
Air: 0.5 MPa, for driving the mask stage and microscope
N2: 0.5 MPa, for blowup
Vacuum: -0.08 MPa, for suction of masks and substrates |
Outside dimensions (in mm, including anti-vibration table) |
1000 W × 1300 H × 800 D |
Weight |
290 kg |
Anti-vibration table |
Included as standard |
Note: Specifications are subject to change without notice.